http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200012766-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-168 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0397 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 |
| filingDate | 2019-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd6b9d0f9c4f086cca5768a6f099a6ac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_164dc69fc7a29d8ef9a68fac4f41772f |
| publicationDate | 2020-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20200012766-A |
| titleOfInvention | Chemically amplified positive-type photosensitive resin composition, method of manufacturing substrate with template and method of manufacturing plated article |
| abstract | (Problem) The chemically amplified positive photosensitive resin composition which can suppress adhesion of the residue of a mold to the plated molding at the time of removing a mold after manufacture of a plating molding, and the said chemically amplifying positive photosensitive resin composition are used. It provides the manufacturing method of the board | substrate with a casting mold, and the manufacturing method of the plating molding using the said chemically amplified positive type photosensitive resin composition. (Solution means) A chemically amplified positive type photosensitive resin composition containing a predetermined component containing a predetermined amount of an organic solvent (S1) having a boiling point of 120 to 180 ° C and satisfying the following [Requirement 1] is used. [Requirement 1] The solvent residual ratio measured by the following processes 1) and 2) is 3.5 mass% or less. 1) A 40 micrometers coating film is formed by apply | coating a chemically amplified positive type photosensitive resin composition to a board | substrate. 2) Bake for 30 seconds at the temperature 10 degreeC higher than the boiling point of the organic solvent (S1), and calculate the ratio of the organic solvent (S1) in the total mass of the coating film after baking by GC (gas chromatography). (Selectivity) none |
| priorityDate | 2018-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 669.