| abstract |
When molding to a cured film, it provides the photosensitive resin composition which has high breaking elongation and is excellent in storage stability, a polymer precursor, a cured film, a laminated body, the manufacturing method of a cured film, and a semiconductor device. The acid value of the acid group in which the pH of the neutralization point which the polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor, an optical radical polymerization initiator, and a solvent are contained in a polymer precursor is in the range of 7.0-12.0 is 2.5 The photosensitive resin composition exists in the range of -34.0 mgKOH / g, and a polymer precursor has a radically polymerizable group or contains radically polymerizable compounds other than a polymer precursor. |