| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1675 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 |
| filingDate |
2019-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f14b0dec39d7593ed7c046749fbac23d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_737d0738bf7930f4043dad7b83da1dac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a05386c550c9bf9d07f884e8bc3a75f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a86dd635ae28d65b2684c2e44e7e9181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7a876c5cef2876422c8960f2ce927c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57520725a52b3190fbc9cafd6aad4e50 |
| publicationDate |
2019-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20190142237-A |
| titleOfInvention |
Electroless copper plating compositions and methods for electroless plating copper on substrates |
| abstract |
Stable electroless copper plating baths include pyridinium compounds to enhance the copper deposition rate on the substrate. Copper from the electroless copper plating bath can be plated at high plating rates at low temperatures. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102173164-B1 |
| priorityDate |
2018-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |