http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190134815-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2400-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-0427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-04 |
| filingDate | 2019-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8dc9e5192513faf9b90c97711e270725 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d7998c48ef7ad6559dec47b2e0f174c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33b83b7840909b46222a0193fe835b8e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9392b25f64a5764655d9c64bd1e92f3 |
| publicationDate | 2019-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20190134815-A |
| titleOfInvention | Curable resin composition, dry film, and its hardened | cured material, and printed wiring board |
| abstract | Even when forming the cured film in which the place where the coating film of curable resin composition overlapped exists on a circuit board, a crack and peeling generate | occur | produce in a cured film, maintaining adhesiveness of a base material (insulation part) and a circuit (conductive part). The curable resin composition which is hard to do is provided. Curable resin composition of this invention is curable resin composition which consists of curable resin, The said insulating part and said hardening at the time of forming cured film (alpha) containing the hardened | cured material of this curable resin composition on the surface of a base material. Shear strength of the said electroconductive part and the said cured film (alpha) when the shear strength of the coating (alpha) was formed on the surface of the electroconductive part of a base material by A (MPa) and the cured coating (alpha) containing the hardened | cured material of this curable resin composition The cured film α and the cured film when the cured film α containing B (MPa) and the cured product of the curable resin composition are formed on the surface of the cured film β containing the cured product of the curable resin composition. When the shear strength of β is C (MPa), all of A, B and C are 1 MPa or more and 15 MPa or less, and A and B are 0.5 to 5 times C. |
| priorityDate | 2018-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 201.