| abstract |
The present invention provides a substrate processing method and a substrate processing apparatus which shorten the throughput by shortening the temperature raising time and the temperature lowering time of the substrate mounting table when performing a plurality of processes having different temperatures. A substrate processing method of the present disclosure includes a first processing step of treating a substrate by controlling the substrate mounting temperature at a first temperature, and adjusting the substrate mounting temperature to a second temperature higher than the first temperature to adjust the substrate. And a second processing step of processing, wherein when the substrate mounting table is temperature-controlled from the first temperature to the second temperature, the refrigerant at a first flow rate that maintains a set temperature of the chiller from the chiller to the refrigerant flow path. The heater is operated and the temperature of the substrate mounting table is adjusted from the second temperature to the first temperature, and the coolant at the second flow rate having a larger flow rate than the first flow rate is discharged from the chiller. It distribute | circulates in a refrigerant | coolant flow path, starts a said heater, or stops an operation of the said heater. |