| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b20bda77d45f8eaec3c02ac134999075 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 |
| filingDate |
2018-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_021b09f48ea688f62c0c0013555fed32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a737c1a9a840c80a46da8594dee19ddd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_448cd7a349db8234916eae670c4c8448
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cfbce5a50def6f2ea5898c6542ad706
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6de3dc5833039121a14993a453304e0e |
| publicationDate |
2019-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20190130946-A |
| titleOfInvention |
Semiconductor Package with heatsink |
| abstract |
A semiconductor package according to an exemplary embodiment of the present disclosure includes a semiconductor chip including a chip pad; A redistribution layer electrically connected to the chip pad of the semiconductor chip; An external connection terminal electrically connected to the redistribution layer; An encapsulant configured to cover the semiconductor chip and to fix the semiconductor chip and the redistribution layer; An adhesive film positioned on an upper surface of the encapsulant; And a heat sink formed on an upper surface of the adhesive film and having a step at an edge thereof. |
| priorityDate |
2018-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |