| abstract |
The process of forming the article uses an ultra thin, removable catalyst film for laser direct structuring (LDS). The process includes forming a film with a laser activated material exhibiting a thickness of less than 100 μm; Applying the film to a black or opaque substrate to form a film-substrate element; Applying a laser to the film-substrate element; Removing the film portion from the film-substrate element; And applying a metal plating to a portion of the black or opaque substrate. Removal of the film from the film-substrate element may follow the metal plating of the black or opaque substrate. The article formed by the process may be a computer device, an electromagnetic interference device, a printed circuit, a Wi-Fi device, a Bluetooth device, a GPS device, a cellular antenna device, a smartphone device, an automotive device, a medical device, a sensor device, an RF antenna device, an LED device , Components of an RFID device or a cell phone antenna. |