http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190129204-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_df1a352837aa7982588868bd24f1c70e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2018-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_351c7abaa320c66b73450b9f4140845b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de3b4689b81873dd125d6f67a1be6095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18be838440ceebb71a61478b7035a92b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ea56b291d7adcea4121bdf5604d6d9c |
| publicationDate | 2019-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20190129204-A |
| titleOfInvention | Metal surface treatment method having improved adhesion property with resin layer for laminating process of multil-layer printed circuit board |
| abstract | The present invention is a method of treating a metal surface by etching the tin-plated film with an etching solution containing an acidic or neutral oxidizing material, a surfactant, a complexing agent and a coupling agent to dissolve the tin after electroless tin plating on the surface of the metal substrate. The present invention relates to a method of manufacturing a laminate using the same and a printed circuit board including the laminate. According to the present invention, a process step may be simplified by integrating an existing etching process and a surface modification process into one, thereby minimizing process time and labor. have. In addition, as the nitrate or silver nitrate contained in the etching solution dissolves tin, the plating surface is etched to maintain a low surface roughness value, and the metal plating layer is reduced because the silane coupling agent reacts with the tin oxide surface to modify the metal surface. Surface roughness can be easily controlled without. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102352447-B1 |
| priorityDate | 2018-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.