| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c703ab7ee52c3d2620142474d9e978fc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G09G3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G09G3-2003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G09G3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0756
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G09G3-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate |
2018-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8186c92726d8fb7babbed555508ea66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efde5c19793ed13299ac3ddfd8fdb252
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0736fdce7e359bb17da8b3b55126bd1b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c06d0654e008fe27bf77814a45b9e5b8 |
| publicationDate |
2019-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20190127872-A |
| titleOfInvention |
Manufacture semiconductor device by laminating micro LED layers |
| abstract |
By repeatedly joining the unpatterned epitaxial structure, a stack of layers containing LEDs is produced. Since the epitaxial structure is not patterned (eg, not patterned with individual micro LEDs), the need for alignment is alleviated considerably. An exemplary embodiment is an integrated multi-color LED display panel in which an array of micro LEDs is integrated with a corresponding driver circuit. A plurality of micro LED layers are stacked on a support substrate comprising a driver circuit. In this process, each layer is produced as follows. The unpatterned epitaxial structure is bonded onto the existing device. The epitaxial structure is then patterned to form micro LEDs. The layer is filled and planarized so that the unpatterned epitaxial structure of the next layer can be joined. This process is repeated to stack a stack of layers. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022098067-A1 |
| priorityDate |
2017-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |