| abstract |
The present disclosure relates to systems, methods, and compositions for the direct printing of printed circuit boards with embedded integrated chips. Specifically, the present disclosure uses a combination of printheads with conductive and dielectric ink compositions, creates predetermined dedicated compartments for positioning chips and / or chip packages, and converts them between embedded chips. A system method and composition for direct top-down inkjet printing of a printed circuit board with embedded chips and / or chip packages, while maintaining connectivity, is covered with an encapsulation layer. Placement of the chip can be performed automatically using the robotic arm. |