| abstract |
An object of the present invention is to provide a photosensitive siloxane resin composition which can be cured at low temperatures, has excellent storage stability and resolution, can suppress development residues, has a high hardness, and can provide a cured film excellent in chemical resistance and substrate adhesion. Shall be. This invention is the photosensitive siloxane resin composition containing (A) polysiloxane, (B) radical photopolymerization initiator, (C) polyfunctional monomer, and (D) phosphate derivative amine salt. |