abstract |
The thermosetting resin composition is a polyester amide acid (A), an epoxy compound (B) having a weight average molecular weight of less than 10,000, and oxiranyl or oxetanyl in order to improve adhesion to the substrate, flux resistance, solder resistance and solvent resistance. The copolymer (C) which has a weight average molecular weight which has 10,000 or more is included. |