| abstract |
[Problem] Curable resin composition which is excellent in resolving ability even if it is filled with spherical silica, and excellent in high temperature, high humidity resistance (PCT resistance) and cold-heat cycle resistance (TCT resistance) of hardened | cured material, the dry film containing this composition, and these hard A printed wiring board which has a cargo and this hardened | cured material is provided. [Solution] A curable resin composition containing (A) carboxyl group-containing resin, (B) photopolymerization initiator, (C) epoxy resin, and (D) inorganic filler, and (C) epoxy resin having an epoxy having a biphenyl skeleton. It contains a resin and other solid or semi-solid epoxy resin at normal temperature, (D) As an inorganic filler, it contains spherical silica and barium sulfate, and the compounding ratio of a spherical silica and barium sulfate is 1: (0.5 thru | or by volume ratio). And 5). |