| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4952
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate |
2019-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8465c85ed6bb15aa69d18280fcad4b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7642d11ce862c9e044991c6bf295a464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54f32c9226c4c3eb127c43dcdb678797
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00da519c2b5718b33d60d489dac6a58e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cde44657f4b3ebe2a00bdc2dd5cec7b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb585575844fda5d59e7450da7afad7b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa6ad110a9fc9438dfb4b88af17bc2c7 |
| publicationDate |
2019-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20190109375-A |
| titleOfInvention |
Semiconductor device and manufacturing method of the same |
| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a method for manufacturing the semiconductor device, and more particularly, a semiconductor device and a semiconductor capable of preventing damage to an uppermost semiconductor chip even when excessive force is applied to some extent during a die bonding process or a wire bonding process. A method for manufacturing a device. |
| priorityDate |
2019-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |