| abstract |
Provided is a means for polishing a polishing object including at least one of an impurity doped polycrystalline silicon and an impurity doped amorphous silicon at a high polishing rate. A polishing composition used for polishing a polishing object comprising at least one of an impurity doped polycrystalline silicon and an impurity doped amorphous silicon, comprising: abrasive grains, a dispersion medium, an alkali metal hydroxide, an alkali metal salt of an inorganic acid, and an inorganic acid. A polishing composition comprising at least one alkali compound selected from the group consisting of ammonium salts, alkali metal salts of organic acids, ammonium salts of organic acids, and ammonia. |