| abstract |
The substrate processing apparatus has a coating chamber, and has a coating film forming unit which applies a low surface tension liquid having a surface tension smaller than water to the surface of the substrate in the coating chamber to form a coating film, and a sublimation chamber, A sublimation unit for subliming the coating film formed on the surface of the substrate in the sublimation chamber, decompression means for depressurizing the inside of the sublimation chamber to a pressure lower than atmospheric pressure, main transport means for carrying the substrate into the coating chamber, and the application Local conveyance means for conveying a board | substrate from a chamber to the said sublimation chamber, and the coating film state maintenance means which hold | maintains the said coating film state, while the said local conveyance means conveys the said board | substrate from the said coating chamber to the said sublimation chamber. |