| abstract |
According to some embodiments, light emitting diodes, or semiconductor dies 210, are embedded in polymeric binders 420 and 230, including phosphors in certain embodiments, to form, for example, freestanding white light emitting diodes And / or a plurality of light emitting die (210) embedded within a single volume of binder (420; 230). In some embodiments, the contacts of the semiconductor die 210 may be left uncoated at least partially by the binder or reapplied to the environment before the dies are separated after application of the binders 420 and 230. |