| abstract |
The catalyst laminates are formed of a resin, a fiber reinforcing layer, and catalyst particles such that the catalyst particles are disposed over the entire catalyst laminates, but are excluded from the outer surface of the catalyst laminates. The catalyst laminates have trace channels and vias formed to produce a single or multilayer catalytic laminate printed circuit board. An opening having a location coinciding with the position of the integrated circuit pad is formed in the laminate PCB. The integrated circuit is bonded to the catalytically laminated PCB, and both the integrated circuit and the laminate are electrically connected to the single or multilayer catalytic laminate PCB via electroless plating. |