| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7689e9aa4e22ebbe003ff5f0db439d9a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3731
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate |
2017-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_785049bbea973ad0d8ba9faff63bded3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_682cbba4d3a223fa1971b48c4b9be44e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ad968a3d7f406aa3445a66ccb35f85e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c8a8444669273a782fa68e95a492a01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0407ced97c5696679179b9d77809ac9d |
| publicationDate |
2019-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20190046828-A |
| titleOfInvention |
Heat dissipation structure of electric circuit device |
| abstract |
A heat dissipation structure of an electric circuit device excellent in mass productivity and having high heat dissipation property is provided. A heat dissipation structure of an electric circuit device including a heat dissipation plate exposed to the outside of an electric circuit device, a heat transfer member, and a cooler arranged so as to have a laminated structure, wherein the heat transfer member has a three- And a resin composition is impregnated into the sintered body, and the ceramic sintered body is disposed so as to be in direct contact with at least one of the heat sink and the cooler. |
| priorityDate |
2016-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |