| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-00 |
| filingDate |
2017-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8c0c39bc943c5917f779d0574709cbc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2491414acab054e511a3e7bce4e222c7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc46feb44b9557b67015f6fb6b3565b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dccf77564b8f3958162436a14b34237d |
| publicationDate |
2019-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20190039392-A |
| titleOfInvention |
A laminate containing a low dielectric adhesive layer |
| abstract |
The present invention provides a laminate which has high adhesion to a low-polarity resin base material such as LCP or a metal base material as well as conventional polyimide and polyester films, can achieve high solder heat resistance, and is excellent in low dielectric properties . (1) a laminated body (Z) obtained by removing a metal substrate from a laminated body (Z) at a frequency (1) of a laminated body (X) obtained by removing a metal substrate from a laminated body relative dielectric constant of the ㎒ (ε c), and is 3.0 or less, (2) a laminate of a dielectric loss tangent (tanδ) of the frequency 1 ㎒ of the layered product (X) to remove the metal base from (Z) is more than 0.02, (3) the peel strength between the resin base material and the metal base is 0.5 N / mm or more; and (4) the laminate (Z) has a heat resistance of humidifying solder of 240 캜 or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210080286-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102254212-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102259097-B1 |
| priorityDate |
2016-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |