| abstract |
The present invention relates to polyamide molding compounds consisting of the following components: (A) of 35-68 wt%, having a melting point (T m) of at least 270 ℃, at least one semicrystalline (semicrystalline), semi-aromatic semiaromatic, thermoplastic polyamides; (B) 13-22 wt% carbon fiber; (C) glass fibers of 18-30 wt%; (D) 1-10% by weight of an impact modifier other than (E) and / or polymers other than (A), (E) and (F); (E) 0-10 wt% ethylene-vinyl acetate copolymer; (F) 0-3 wt% of an additive. Wherein the sum of the components (A) - (F) is 100 wt%, the sum of the components (B) - (C) is in the range of 33-48 wt% To 12 wt%. The molding compound allows for the production of dimensionally stable, electrically conductive parts for contact with, for example, automotive sectors and with fuels, particularly methanol-containing petroleum. |