| abstract |
This disclosure relates to the field of electronic communications and discloses a housing, a method of manufacturing a housing, and uses thereof. The housing comprises a rigid anode metal oxide layer 5 and a resin film layer 3 adhered to the first surface of the rigid anode metal oxide layer 5. The rigid anode metal oxide layer 5 and the resin film layer 3 form an integral structure. The manufacturing method includes hard anodizing the metal substrate 1, and then performing injection molding and etching. |