| abstract |
A resin composition excellent in coating film property and heat resistance when used in a multilayer printed circuit board, excellent in plating adhesion and developability, a resin sheet on which a support is formed, a multilayer printed wiring board using the same, and a semiconductor device. (A), a photocuring initiator (B), a compound (C) represented by the following formula (2) and a compound having an ethylenic unsaturated group other than the component (C) (D). |