http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190003744-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1208 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D2350-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate | 2017-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d88d0a69810cd271f272de7dfc67df5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_217fd2dbe27cf853d70732db5a5696d8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce8244193fc862709d3e404693cd7c46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84d97483f48563730bc6fa13242285ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e50869ab5a51ab5add086062cacb249f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7118c0d67ab2ed836aa608aaec065027 |
| publicationDate | 2019-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20190003744-A |
| titleOfInvention | Electrodeposition method comprising activation of a metal or metal alloy on a surface of a substrate |
| abstract | The present invention relates to a method of electrodepositing a metal or metal alloy on at least one surface of a substrate, comprising the steps of: (a) providing the substrate; (b) contacting the surface of the substrate with an activating solution comprising a source of at least one metal ion selected from the group consisting of ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, silver, nickel, cobalt, gold, So that at least one portion of the metal ion is adsorbed onto the surface of the substrate; (c) treating the surface of the substrate obtained from step (b) with a treatment solution comprising: i) at least one additive selected from the group consisting of thiols, thioethers, disulfides and sulfur-containing heterocycles, and ii) a boron-based reducing agent, a source of hypophosphite ions, hydrazine and hydrazine derivatives, a source of ascorbic acid, iso-ascorbic acid, a source of formaldehyde, glyoxylic acid, a source of glyoxylic acid, glycolic acid, formic acid, One or more reducing agents suitable for reducing metal ions adsorbed on the surface of the substrate, selected from the group consisting of the salts of the acids mentioned; And (d) treating the surface obtained from step (c) of the substrate with a metallizing solution comprising a solvent and a source of at least one metal ion to be electrodeposited, so that the metal or metal alloy is electrodeposited thereto. Substrate metallization methods are mostly useful in the electronics industry as well as in metallization methods of typical non-conductive substrates such as plastics. The method is cost-effective and ecologically advantageous, due to the reduction of its essential amount of total chemicals. |
| priorityDate | 2016-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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