http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180117814-A

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filingDate 2017-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c75b4463326ef33c8c39592ccd35516
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publicationDate 2018-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20180117814-A
titleOfInvention Copper foil with enhanced adhesion property by having hydrophilic polymer layer, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same
abstract One embodiment of the present invention includes a copper layer, a rust preventive film disposed on the copper layer, and a hydrophilic polymer layer disposed on the rust preventive film, wherein the hydrophilic polymer layer is made of polyethylene glycol (PEG), polyethyleneimine (PEI (PEO-PPO-PEO copolymer) selected from the group consisting of polymethylmethacrylate (PMMA), polyacrylonitrile (PAN), polypropylene oxide (PPO) and polyethylene oxide-polypropylene oxide-polyethylene oxide copolymer A copper foil comprising a hydrophilic polymer is provided.
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