| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa0f2776bcc27d5099aa97f3212e1681 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-308 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23D79-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate |
2018-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c29f453808fe9a6e10cd2122be801a5 |
| publicationDate |
2018-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20180112691-A |
| titleOfInvention |
Processing method |
| abstract |
An object of the present invention is to provide a machining method capable of increasing the machining speed while maintaining the machining quality when machining a plate-shaped workpiece formed by stacking a metal-containing laminate on a line along which the substrate is to be divided. A method of processing a plate-shaped workpiece formed by stacking a metal-containing laminate on a line along which a substrate is to be divided, comprising: a first holding step of holding a workpiece with a first holding table such that a laminate is exposed; A second holding step of holding a workpiece on the second holding table such that a mask material provided in an area excluding the line along which the substrate is to be cut is exposed; And a dry etching step of cutting the workpiece along the line along which the substrate is to be cut by performing dry etching on the workpiece through the ash. In the cutting step, cutting is performed while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece . |
| priorityDate |
2017-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |