| abstract |
(A) a novolak type phenolic resin having a weight average molecular weight (Mw) and a number average molecular weight (Mn) dispersion ratio (Mw / Mn) of 1.05 to 1.8, (B) an epoxy resin represented by the general formula (C) an inorganic filler in an average particle diameter of 0.1 占 퐉 or more in the resin composition layer, (C) an inorganic filler, and (C) an inorganic filler, Is 20 to 95% by mass in the resin solid content, is an adhesive film for a multilayer printed wiring board. |