| abstract |
A multilayer printed wiring board (10) excellent in high frequency characteristics is provided. The multilayer printed wiring board 10 according to the present invention has one or a plurality of conductor layers 1 and one or a plurality of insulating layers 2. The multilayer printed wiring board 10 is formed by alternately laminating one or a plurality of conductor layers 1 and one or a plurality of insulating layers 2. Each insulating layer 2 of one or a plurality of insulating layers 2 may be formed of one or more layers of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer . At least one insulating layer (2) of one or a plurality of insulating layers (2) includes a polyolefin resin layer (3). |