| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-37001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2017-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23a2cf1977d010b878081052e89e05e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8dc9e5192513faf9b90c97711e270725
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8ce14d57c22ac7419b44969604a6fb5 |
| publicationDate |
2018-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20180104306-A |
| titleOfInvention |
Curable resin composition and fan-out type wafer level package |
| abstract |
The present invention relates to a curable resin composition capable of suppressing the amount of warpage even at room temperature such as a wafer transfer at the time of mounting a semiconductor wafer or a semiconductor package, particularly a fan-out type wafer level package (FO-WLP), and a cured product of a curable resin composition A wafer-level package of a fan-out type having a bending correction layer is provided. A curable resin composition which can be cured by at least two kinds of curing reactions, wherein the curable component (A1) whose volume is shrunk by the one curing reaction and the curable component (B1) whose volume is shrunk by the other curing reaction ). ≪ / RTI > |
| priorityDate |
2016-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |