abstract |
A resin composition which is excellent in heat resistance and developability when used in a multilayer printed wiring board, a resin sheet having a support, a multilayer printed wiring board using the same, and a semiconductor device. (B), a maleimide compound (C) and / or a blocked isocyanate (D) represented by the following formula (1) and having an acid value of 30 mgKOH / g or more and 120 mgKOH / g or less, . |