| abstract |
It is difficult to undercut the bottom portion and to prevent the upper portion of the resistor from being lost in addition to the basic performance of electrical insulation, soldering heat resistance, thermal shock resistance, solvent resistance, acid resistance and alkali resistance required for the photosensitive resin composition used in the production of printed wiring boards, A dry film, a printed wiring board, and a printed wiring board using the same, which can form a register shape excellent in the linearity of the outline of the resist pattern, excellent in adhesion with the copper substrate and excellent in fluidity, to provide. (C) an ion trapping agent having at least one kind selected from the group consisting of Zr, Bi, Mg and Al, and (C) an ionic group- D) a photopolymerizable compound. |