Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_98a75c9fff239084cf3c988c59841957 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105 |
filingDate |
2018-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64088cc30f69dd9a1036a9b9a31ee853 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc4408ae8b158abb89842fd302e5e12f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a219b4e1153b7f01bd717cd3c4660355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_411c79b40f16a7d284f561a34ce43727 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5355b61940d8d3d8c1adf36b1bb7af62 |
publicationDate |
2018-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20180099570-A |
titleOfInvention |
Chemical mechanical planarization of films comprising elemental silicon |
abstract |
The present invention relates to a chemical mechanical planarization (CMP) polishing composition comprising abrasive particles and additives for increasing the removal rate of a film comprising elemental silicon such as poly-silicon and silicon-germanium. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11180679-B1 |
priorityDate |
2017-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |