| abstract |
The present invention relates to a laminate film having high adhesion to a low-polarity resin base material or a metal base such as LCP, as well as conventional polyimide and polyester films, capable of achieving high solder heat resistance, Provide sieve. (Z) in which a resin substrate and a metal substrate are laminated through an adhesive layer containing a carboxyl group-containing polyolefin resin (A), wherein (1) the relative dielectric constant (? C ) of the adhesive layer at a frequency of 1 MHz is 3.0 or less (2) the adhesive layer has a dielectric loss tangent (tan?) At a frequency of 1 MHz of 0.02 or less, (3) a peel strength between the resin substrate and the metal substrate is 0.5 N / mm or more, (4) (5) the layered product (X) of the adhesive layer and the resin substrate is VTM-0 in the UL-94 method. |