http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180059257-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa80eed27901ac84139c7a7109c21e17 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0611 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-156 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-06 |
| filingDate | 2016-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93c34220f1b85e0a516bebcbf1c7d1e0 |
| publicationDate | 2018-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20180059257-A |
| titleOfInvention | Semiconductor module |
| abstract | The semiconductor module disclosed in the embodiment includes: a base layer; A wiring layer having a plurality of electrode pads and recesses on the base layer; A circuit board having a resin layer on the base layer; And semiconductor devices disposed on the plurality of electrode pads of the circuit board. The resin layer is formed of a reflective material, the resin layer extends to the recess of the wiring layer, and the upper surface of the resin layer is disposed lower than the lower surface of the semiconductor element. |
| priorityDate | 2016-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.