| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0b9d8807dfc5d32e75a1f869c614baa |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02372
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02371
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0557 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14685
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 |
| filingDate |
2016-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc6600b0e1abcb3b66621b46e91cc51d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2b97b6dcd3e69197fbcdf820c008bf8 |
| publicationDate |
2018-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20180056720-A |
| titleOfInvention |
Photosensitive chip packaging structure and packaging method thereof |
| abstract |
A photosensitive chip packaging structure, comprising: a photosensitive chip (210) having a first surface (210a) and a second surface (210b) arranged opposite to each other; a first surface (210a) A photosensitive zone 211 is provided; A protective cover plate 330 on which a third surface 330a and a fourth surface 330b are arranged facing each other, a third surface 330a covering the first surface 210a; And a light shielding layer 511 arranged on the fourth surface 330b of the protective cover plate 330. An opening is arranged on the light shielding layer 511 and the opening exposes the photosensitive zone 211 , The light-shielding layer 511 includes a light absorbing layer 501 positioned on the fourth surface 330b and a metal layer 502 located on the light absorbing layer 501; By forming the light-shielding layer 511 on the protective cover plate 330 of the photosensitive chip packaging structure, defects of the photosensitive chip such as poor imaging and ghosting are removed to improve the imaging quality of the photosensitive chip. |
| priorityDate |
2015-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |