http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180056609-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5ad8562c578b061df7a2c3aee9d0e24 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02W30-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02W30-625 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J11-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J11-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J11-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J11-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J11-06 |
| filingDate | 2018-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7720db4042a1528c9f07e037abffbbb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4358bcfb48e53e07a09906c0dc3c144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62eafecc08630ad3f9bb9b993b7df1ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4182844ae6d7b0027338bb96a31d42eb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_691cf606bb02afb37715670328b095fd |
| publicationDate | 2018-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20180056609-A |
| titleOfInvention | Method and composition for depolymerization of cured epoxy resin materials |
| abstract | A compound represented by the formula XOmYn wherein X is hydrogen, an alkali metal or an alkaline earth metal, Y is halogen, m is 1? M? 8 and n is 1? N? 6, Wherein a composition capable of dissociating X from XOY and providing a Y radical in the reaction solvent can be used to depolymerize the epoxy resin cured product. Thus, depolymerization of the epoxy resin cured product can be processed very simply and quickly under the condition of, for example, 200 ° C or less, more preferably 100 ° C or less, and the process cost and energy required can be reduced. In addition, it is possible to replace the reaction system using an organic solvent as a main solvent, thereby solving the problem of contamination due to the organic solvent acting as a separate source of pollution, thereby minimizing environmental pollution and pollution. Further, the depolymerization reaction efficiency can be improved without using a reaction system using an organic solvent as a main solvent. In addition, epoxy resin cured products which are relatively difficult to decompose can be easily decomposed. Further, deterioration of the properties of the filler recovered after decomposition of the epoxy resin cured product can be prevented, and a recycled filler excellent in characteristics can be obtained. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210083149-A |
| priorityDate | 2015-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.