| abstract |
One embodiment relates to an ultraviolet curable resin composition for manufacturing a polishing pad, a porous polyurethane polishing pad and a method for manufacturing the same, which are used in a chemical mechanical planarization (CMP) process of a semiconductor, wherein the ultraviolet- Capsules containing a solid foaming agent but can be cured at a low temperature, so that they can be usefully used for producing a porous polyurethane polishing pad having a uniform and fine pore size pore. |