| abstract |
[Summary] The present invention relates to a tetracarboxylic acid diester compound capable of inducing a polymer of a polyimide precursor which can be used as a base resin of a negative-type photosensitive resin composition capable of forming a fine pattern and capable of obtaining high resolution, A polymer of a polyimide precursor obtained by using a carboxylate diester compound, and a process for producing the same. [MEANS FOR SOLVING PROBLEMS] A tetracarboxylic acid diester compound represented by the following general formula (1). (Wherein X 1 is a tetravalent organic group and R 1 is a group represented by the following general formula (2)): (Wherein the dashed line represents a bond, Y 1 is a monovalent organic group (k + 1), Rs is a group containing at least one silicon atom, k represents 1, 2, or 3, n is 0 Or 1). |