| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58 |
| filingDate |
2016-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_563ed22bcbd6be9a363d8c7652942c27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_897fc2c9a55397b7d7770862d6715698
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f9f84caa48be31817fbffdfd6968daa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2ad1c3ad155342e38849d635d60ffc7 |
| publicationDate |
2018-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20180045011-A |
| titleOfInvention |
A method of depositing an aqueous copper plating bath and a copper or copper alloy on a substrate |
| abstract |
The present invention relates to printed circuit boards, IC substrates, bis-urea derivatives in aqueous plating baths for copper and copper alloy deposition in the manufacture of semiconductors and glass elements for electronic applications and their use. The plating bath according to the present invention comprises at least one copper ion source and a bisurea derivative. The plating vessel is intended for filling a recessed structure by the formation of copper and pillar bump structures. |
| priorityDate |
2015-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |