| abstract |
Provided is a thermosetting resin composition capable of suppressing positional shift due to thermal history. The thermosetting resin composition of the present invention is a thermosetting resin composition used for forming a resin encapsulation substrate and satisfies the following condition 1. (Condition 1) After the cured product of the thermosetting resin composition was obtained by transfer molding (175 DEG C, 120 seconds), the cured product was subjected to a first heat treatment (175 DEG C, 4 hours) to a mold dimension of the cured product at 25 DEG C after the shrinkage ratio in S 1 (%), and further, and the time at which the respect to the cured product reaches the second heat treatment (190 ℃ to t1, temperature rise in the art 190 ℃ to 233 ± 3 ℃, 190 (125 占 폚 for 2 hours) and the fourth heat treatment (175 占 폚, 6 hours) in the order of t1, t2, t1, when the shrinkage ratio at 25 ℃ for the cured product of the dimensions of the mold, when subjected to treatment with S 4 (%), satisfies the following expression. 0.85 x S 1 ? S 4? 1.15 x S 1 (1-1) |