| abstract |
One embodiment of the present invention relates to a urethane-based prepolymer, a porous polyurethane polishing pad, and a method for producing the same, which are used in a chemical mechanical planarization process of a semiconductor. The urethane-based prepolymer has excellent storage stability, The reaction rate of the raw material mixture (time for solidification of the mixture, gelling time) can be controlled during the manufacture of the urethane polishing pad. Accordingly, by using the urethane-based prepolymer, it is possible to easily produce a porous polyurethane polishing pad having a pore having a desired size of particle size and a small deviation between the upper and lower portions without using a catalyst. |