| abstract |
Embodiments of the present invention generally relate to a method for enhancing adhesion or bonding to a substrate by treatment of a metal surface, and apparatus formed thereby. In some embodiments of the present invention, a method is provided for obtaining improved bond strength without roughening the topography of metal surfaces. The metal surface obtained by this method provides strong bonding to the resin layer. The bonded interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in the post-lamination step, and thus can be suitably used for PCB production. The method according to some embodiments of the present invention is particularly useful for the manufacture of high density multilayer PCBs, especially for PCBs having circuitry with a line / spacing of 10 microns or less. The method according to another embodiment of the present invention is particularly useful in a wide variety of applications, particularly for coating metal surfaces. |