| abstract |
A method of manufacturing a flexible printed circuit includes providing a carrier support composed of a rigid support base and an ejection layer deposited in contact with each other, forming a flexible substrate on a carrier support, Applying one or more processing steps on the flexible substrate while the flexible substrate is supported by the carrier support, and wherein the emissive layer remains deposited in contact with the support base, And peeling the flexible substrate with an electronic circuit formed thereon from the layer. |