| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2201-622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J125-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12 |
| filingDate |
2016-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2491414acab054e511a3e7bce4e222c7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8c0c39bc943c5917f779d0574709cbc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc46feb44b9557b67015f6fb6b3565b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dccf77564b8f3958162436a14b34237d |
| publicationDate |
2018-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20180008373-A |
| titleOfInvention |
Laminate comprising low dielectric constant adhesive layer |
| abstract |
Provided is a laminate which has high adhesion with a low-polarity resin base material such as LCP or a metal base material as well as conventional polyimide and polyester films, can achieve high solder heat resistance, and is excellent in low dielectric properties. (Z) having a resin substrate and a metal substrate laminated via an adhesive layer containing a carboxyl group-containing polyolefin resin (A), wherein (1) the adhesive layer has a relative dielectric constant (? C ) at a frequency of 1 MHz of not more than 3.0 (2) the dielectric loss tangent (tan?) Of the adhesive layer at a frequency of 1 MHz is 0.02 or less, (3) the peel strength between the resin substrate and the metal substrate is 0.5 N / mm or more, (4) (Z) characterized in that the heat resistance of the humidifying solder is 240 占 폚 or higher. |
| priorityDate |
2015-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |