http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180005597-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_78c81eee3745be3f24f94e9de1686991 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 |
filingDate | 2017-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b836dfc56fb206ed4b4ba5284bc49a6 |
publicationDate | 2018-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20180005597-A |
titleOfInvention | Photosensitive compositions |
abstract | The present invention relates to a photosensitive composition for a protective film having a good heat resistance and a wide drying temperature margin against developer penetration. The photosensitive composition of the present invention contains a polyester amide acid (A), an epoxy group-containing copolymer (B) and a 1,2-quinone diazide compound (C) (B1) having an epoxy group and a polymerizable compound (b1) other than (b1), wherein the epoxy group-containing copolymer (B) comprises a structural unit represented by the following formula (b2), and the polymerizable compound (b2) includes at least one selected from a compound represented by the following formula (3) and a compound represented by the following formula (4) |
priorityDate | 2016-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 256.