| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0273
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0244ebee82acf9855c3693235d5c163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3644f669831dc36109218bbc080e0db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_961f0547d9c81ce48ea4c4a4d910987e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa4cd50c7a929ccc37fd1b00b908a0cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cc6ed9d1c804f72bc22a820a437bc4f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c14e603446edd7c740cff9bd6060ed53 |
| publicationDate |
2018-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20180001512-A |
| titleOfInvention |
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides |
| abstract |
The electroplating process enables plating of photoresist forming features having a substantially uniform shape. The electroplating process includes a copper electroplating bath having a reaction product of a pyrazole compound and bis epoxide to electroplating the photoresist forming feature. The feature includes a pillar, an engagement pad, and a line space feature. |
| priorityDate |
2016-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |