| abstract |
Disclosed herein are silicone-modified polyimide resin compositions that are solventless. The compositions are suitable for use as curable adhesives and coating materials upon irradiation of ultraviolet and / or visible light. In addition, it is prevented from flowing down even in the case of light weight charging with inorganic compounds and bubble trapping and non-uniformity in the application of weight filling is prevented. It further exhibits good moldability due to thixotropic properties. Moreover, it exhibits improved adhesion to polyolefin resins without compromising the previous properties. Finally, it produces a cured product, which is not too hard and has a low modulus of elasticity, despite its charging with inorganic compounds. The composition of the present invention comprises the components (A) to (E) listed below and is characterized in that it is a liquid at 25 DEG C and free of solvent: (A) a silicone-modified polyimide resin; (B) a polymerizable compound; (C) a polymerization initiator; (D) hydrophobic fumed silica; And (E) Adhesion aid. |