| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0614 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 |
| filingDate |
2016-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b1360101f80233fa3480c9b51491c22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a41b378af6ee82a27daa7f21738f169
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7df826607bc3f67fde417d673f2e1b8 |
| publicationDate |
2017-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170137932-A |
| titleOfInvention |
Roughened copper foil, copper clad laminate and printed wiring board |
| abstract |
There is provided a roughened copper foil capable of achieving both a fine circuit formability (in particular, a circuit linearity) and an adhesion property to a resin in the production of a copper clad laminate or the production of a printed wiring board. The surface-roughened copper foil of the present invention has a roughened surface on at least one side and the roughened surface has an arithmetic mean height Sa (mu m) measured in accordance with ISO 25178 and a peak apex density Spd And the arithmetic average curvature Wa measured in accordance with JIS B0601-2001 is 0.030 to 0.060 占 퐉. |
| priorityDate |
2015-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |