| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c85d78c6a4459b5dbbc49c82a4c5c107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D265-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D413-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D241-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate |
2015-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d18d7eb8334b789ce24fc24c3c2c876b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3567d7767003f7cc4e8b7525a6541196
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45987a7db67e935585413d4320f343e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b27cba807873e4d9e2436fa3363b9408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6ef9d8ceb04fdf0c75b043d7269631d |
| publicationDate |
2017-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170134732-A |
| titleOfInvention |
Reaction products of bison hydride and diamine as additives for electroplating baths |
| abstract |
The reaction products of the primary and secondary diamines with bison hydrides are included as additives in the metal electroplating bath. The metal electroplating bath deposits a metal layer having a substantially uniform electrodepositability and a substantially planar surface. A metal plating bath can be used to deposit metal on a substrate having surface features such as through-holes and vias. |
| priorityDate |
2015-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |