Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d2bc59d0b56fe627886f614d26108e4c |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2311-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-206 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate |
2016-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_470a94cd39954aaea8e6044c6b813653 |
publicationDate |
2017-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20170133873-A |
titleOfInvention |
Flexible copper coveray film and flexible circiut board including the same for forming fine wiring |
abstract |
The present invention relates to a coverlay adhesive layer; A flexible substrate insulation layer formed on an upper surface of the coverlay adhesive layer and made of a polymer material; And a first copper foil layer formed on the upper portion of the flexible substrate insulation layer by plating, and a flexible circuit board for micro wiring including the same. |
priorityDate |
2016-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |